Elaborate measurements prove that Sony has not worsened the performance and loudness in the new cooler revision of the Playstation 5.
Sony has been shipping the Playstation 5 Digital Edition with the model number CFI-1100B01 for a few weeks now, which differs significantly from the previous variant called CFI-1000B in one aspect: The cooler is significantly smaller and weighs 300 grams less, which led to speculations that it is worse.
However, Sony’s team has actually done a great job: As the test setup from Hardware Busters International (via Igor’s Lab) shows, the revision of the Playstation 5 is accompanied by lower temperatures. Mind you, this is true with virtually identical power consumption and loudness of the console; there are no changes from the previous revision here.
To log the temperatures, a dozen sensors were placed on the board Playstation 5. Three of them are located on the back of the APU, i.e. the Zen 2 processor with integrated RDNA2 graphics, more precisely on the SMD components and the cooler bracket. The chip itself cannot be measured, because otherwise the liquid metal used as heat conduction medium would have had to be replaced.
Lighter is better
Further measuring sensors are located next to the GDDR6 memory modules and next to the NAND flash, so that the values can be roughly compared with those of the test of an original Playstation 5 from Hardware Nexus. Normalized to room temperature, the APU of the new revision is cooler than the old one (around 10 Kelvin) and gets absolutely almost identically hot, whereas the voltage converters and the video memory are slightly colder.
For what reason a 300 gram lighter cooler is better can at least be surmised: Although there are far fewer aluminum fins and thus a smaller surface area, the heat dissipation of the modified heatpipes seems to more than compensate for this. There are still six of them, but they are round instead of flattened and much less curved – both improve the performance.
Voltage supply has been adjusted
In addition, Sony has also reworked the PCB, especially the APU’s power supply has been optimized in three revisions. Together with the lighter cooler, the weight of the console can be reduced, which saves costs during transport – and the new design might also be cheaper in production.
Moreover, Sony should have already submitted a slim version or at least gained experience with a more compact cooling system. However, it can be assumed that the APU gets a shrink from 7 nm to 6 nm to reduce the power consumption.